Đế Kết Nối CPU Foxconn H3 LGA1150 / 1 / 6

Giới thiệu Đế Kết Nối CPU Foxconn H3 LGA1150 / 1 / 6

Product Description
Date Code: Lastest
Condition: Brand New
Package:
Supply Voltage: International standard
Dissipation Power: International standard
Operating Temperature: International standard
Parcel includes: 1PC
Important Notice
Dear Buyers,

Please pay attention to the following instruction upon receipt our chips
The BGA chips you buy from our company are of high technology and as precise as nanometer.
For small quantity of chips, they are exposed to the air after being taken out from package. So they probably will adhere to some humidity. Thus, in order to avoid quality problem, we suggest that you put them inside a baking chamber for at least 24 hours at 100℃-110℃。

When soldering, please control the temprature precisely.
Lead-Free/No Pb BGA chips is 245℃--260℃ (Maximum)
Leaded/Pb BGA chips 180℃--205℃ (Maximum).

The soldering process is complicated. Soldering/replacing chips must be operated by engineers who have proficient skills.
As BGA chips are fragile, complicatedly structured, with numerous balls, any slightly faulty positioning, careless temperature-control, or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering. The chips will, as a result, die.
BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points:
1) Have you bought the right chips?
2) Do you have proper equipment?
3) Are you skillful enough to solder the chips?
If you are not confident to solder it, please don't buy.

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